Test Items HTCA-60-1
板厚
Total thickness (mm) 1.040~1.146
絕緣層厚度
Dielectric thickness (μm) 60±5
銅厚
Copper thickness (μm) 36±3
尺寸
Size 320 x 520
拉力強度
Peel strength
(As received) ≧2.0 kgf/cm
(≧ 11.2 lbf/inch)
After solder ≧1.6 kgf/cm
錫爐測試
Solder Float Resistance 300℃/30sec pass
化性測試
Chemical Resistance PASS
耐燃性
Flammability 94V0 pass
表面阻抗
Surface Resistance (ohm) > E+14
體積阻抗
Volume Resistance (ohm.cm) >E+15
破壞電壓
breakdown voltage (KV) >2
玻離轉移溫度
Glass Transzition temp. ℃ 110
熱傳導率
Thermal conductivity (W/m.k) 1.5~3
儲存週期
Shelf life 6 month (< 25℃ < 60RH)
85℃x85RH x10day
peel ≧1.6 kgf/cm
solder 300℃x30sec pass
|
|
|
|
|
